Ormecon Launches New Metal Surface Treatment Process

Recently, Ormecon International introduced a new nano-size surface treatment process to the printed circuit board market. The surface layer is composed of nano-particle composites formed of organic nano-metals and silver (less than 10% of silver), and its thickness is only 55 nm.

Although the thickness of this new nano-treatment is only 1/100th to 1/6th of the thickness of any other conventional metal treatment, its ultra-thin layers provide even greater resistance to oxidation and soldering.

Ormecon stated that several trials in many companies in the electronics industry have shown that the process is more resistant to heat and perfect solderability.

In July 2007, the inventor and Dr. Bernhard Wessling, CEO of Ormecon, introduced the process for the first time. Only three months later, the first industrial production line for this new nanotechnology process will be at Orocon's Korean customer Yoo Jin. Install it. The production line will begin operation in the second half of October.

This will be the first commercial line to provide nano-sized surface finishes for printed circuit boards.

Compared with the traditional surface treatment process, the energy consumption of this treatment process is only 10% to 30% of the original, and the total environmental resource consumption is less than 1%.

Background Information:

Printed circuit boards (PCBs) are the foundation for all electric and electronic control operations of computers, mobile phones, printers, televisions, electronic controls, and automobiles, airplanes, satellites, elevators, dishwashers, washing machines, refrigerators, and even modern coffee machines.

Chips and other electronic components are fixed (soldered) at specific locations on the printed circuit board. The circuit board contains circuits in which the elements are connected to each other.

The industry's fully functional printed circuit boards are manufactured separately. First, printed circuit board manufacturers make bare boards. Then, the so-called assembler mounts the electronic components on the circuit board and firmly fixes them by heat welding.

The installation and thermal welding processes are all automated and require several runs at a maximum temperature of approximately 260 degrees Celsius. Therefore, this requires that 100% ensure that all of these subtle parts of the small copper dots can receive solder and form a connection even when the temperature is at a low temperature, whether it is in continuous vibration (such as in a car or an airplane) or in a stable situation. The connection between the lower space temperature and the high-speed operating temperature of up to 80 to 150 degrees Celsius (close to the internal temperature of the engine or laptop) can also be stabilized for a long period of time.

Therefore, the final surface treatment is the most critical step in the manufacture of printed circuit boards. The new nano-treatment is expected to revolutionize the surface treatment of printed circuit boards.

Ormecon International is a small international operating group company. The company was founded by Dr. Bernhard Wessling who discovered and proposed a new category of organometallic nanomaterials.